The latest SoC integrated chip is here: Dimensity 1000

In this article, the editor will introduce an integrated chip released today – Dimensity 1000. What is its specific situation? Let’s take a look.

According to MediaTek, “Dimensity” will run through its 5G chip solution, similar to Helio in the 4G era.

In terms of basic parameters, the Dimensity 1000 is built with a 7nm process. The CPU integrates 4 large Cortex A77 cores with a frequency of 2.6GHz and 4 small Cortex A55 cores with a frequency of 2.0GHz. The GPU is also the strongest public version of ARM Mali-G77 MP9. The frequency has not yet been revealed.

In other respects, Dimensity 1000 supports up to 16GB LPDDR4X memory, integrates the third-generation APU (4.5 TOPs, Snapdragon 855 is 7 TOPs), integrates 5G baseband (Helio M, 70, supports Sub 6GHz frequency band, downlink fastest 4600Mbps, SA/ NSA dual-mode), ISP supports up to 80 million pixel single camera and up to 5 cameras, supports 4K 60FPS encoding and decoding.

In terms of details, the Dimensity 1000 also supports Wi-Fi 6, Bluetooth 5.1, 90Hz 2K resolution Display/1080P 120Hz display, etc.

According to MediaTek, the M70 baseband is 30% wider than Qualcomm’s signal reception range, saves 42% of power, and supports dual 5G network standby.

The above is the introduction of Dimensity 1000 brought by this editor. If you like this SoC integrated chip, you may wish to learn more about it by google.

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